Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially

A component carrier, comprising:

• an electrically insulating layer structure;
• a first electrically conductive layer structure covering a front side of the electrically insulating layer structure and having a first window extending through the first electrically conductive layer structure formed by etching using a conformal mask;
• a second electrically conductive layer structure covering a back side of the electrically insulating layer structure and having a second window extending through the second electrically conductive layer structure formed by etching using a conformal mask;
• a laser through-hole extending through the electrically insulating layer structure;
• and
• an electrically conductive filling medium filling at least a part of the laser through-hole;
• wherein at least a portion of at least one sidewall of the electrically conductive layer structures delimiting the windows is tapering,
• wherein the laser through hole is X-shaped having a lateral offset between a center of the first window and a center of the second window which is different from another lateral offset between a center of a first tapering section of the laser through-hole in a front side portion of the electrically insulating layer structure and a center of a second tapering section of the laser through-hole in a back side portion of the electrically insulating layer structure.