Embedded circuit board and method of manufacturing same

An embedded circuit board, comprising:

• at least one layer of sub-body, wherein through slots are provided at presets positions of the sub-bodies;
• an inductance element embedded within the slot and configured to be spaced apart from sidewalls of the slots;
• a first circuit layer arranged with conductive columns;
• a second circuit layer, the first circuit layer and the second circuit layer being provided to cover two opposite sides of the slot respectively such that the inductance element is located between the first circuit laver and the second circuit layer, and
• inductance frames, enclosing an exterior of the inductance element;
• wherein the induction element is connected to the first circuit layer via the inductance frames and the conductive columns connected to the inductance frames, the inductance element is connected to the conductive columns via ends of the inductance frames adjacent to the second circuit layer to realize electrical connection to the second circuit layer;
• and
• the inductance frames are configured to assist the inductance element in maintaining an upright state when the sub-bodies are provided to sleeve the inductor element by means of the slots, such that the inductance element always maintains a preset distance from the sidewalls of the slots.