Wiring substrate and electronic device
AssigneeShinko Electric Industries Co., Ltd.
InventorsTakayuki Matsumoto, Tsukasa Nakanishi, Yukinori Hatori
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Abstract
An embodiment is a wiring substrate that includes a first metal plate. The first metal plate includes a first electrode and a wiring, and the wiring includes a mount portion for an electronic component. The wiring substrate further includes a second metal plate. The second metal plate includes a second electrode diffusion-bonded to an upper surface of the first electrode. The second metal plate includes a first opening that exposes the mount portion. The first opening is large enough to accommodate the electronic component.
Claims24
A wiring substrate, comprising:
- a first metal plate including a first electrode and a wiring, the wiring including a mount portion for an electronic component;
- and
- a second metal plate including a second electrode diffusion-bonded to an upper surface of the first electrode, wherein
- the second metal plate includes a first opening that exposes the mount portion, and the first opening is large enough to accommodate the electronic component;
- the first electrode includes a solid first body and a first projection projecting outward from a side surface of the first body and being thinner than the first body, the first projection defining a first recess in the first electrode;
- the second electrode includes a solid second body diffusion-bonded to an upper surface of the first body and a second projection projecting outward from a side surface of the second body and being thinner than the second body, the second projection defining a second recess in the second electrode;
- and
- the wiring substrate further comprises an insulation layer covering the electronic component and filling the first opening, the first recess, and the second recess.
A wiring substrate, comprising:
- a first metal plate including a first electrode and a wiring, the wiring including a mount portion for an electronic component;
- and
- a second metal plate including a second electrode diffusion-bonded to an upper surface of the first electrode, wherein
- the second metal plate includes a first opening that exposes the mount portion, and the first opening is large enough to accommodate the electronic component;
- the first electrode includes a solid first body;
- the second electrode includes a solid second body diffusion-bonded to an upper surface of the first body;
- the first metal plate includes a first frame portion, the first frame portion supporting the first electrode and the wiring,
- the second metal plate includes a second frame portion supporting the second electrode,
- the first frame portion includes:
- a first recess that is thinner than the first body, and
- first protrusions that are spaced apart from each other at a given interval and have a same thickness as the first body,
- the second frame portion includes:
- a second recess that is thinner than the second body, and
- second protrusions that are spaced apart from each other at a given interval and have a same thickness as the second body, and
- the second protrusions are diffusion-bonded to upper surfaces of the first protrusions.
Dependencies are inferred from the claim text.