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US 11,452,209 B2Granted
Electronic component and its manufacturing method
AssigneeTDK Corporation
InventorsYuichiro Okuyama, Takeshi Oohashi, Hajime Kuwajima, Takashi Ohtsuka, Kazuhiro Yoshikawa, Kenichi Yoshida
Life of this patent
Estimating the term…
Abstract
Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.
Claims16
An electronic component comprising:
- a substrate;
- and
- a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate,
- wherein each of the plurality of insulating layers has a lower surface, an upper surface, and a side surface,
- wherein the plurality of insulating layers are laminated such that the upper surface of lower ones of the plurality of insulating layers contacts with the lower surface of upper ones of the plurality of insulating layers,
- wherein the side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part, and
- wherein the at least one of the plurality of insulating layers has the recessed part and the projection part over an entire side periphery thereof.
4 more elements
An electronic component comprising:
- a substrate;
- a planarizing layer formed on the substrate;
- a first conductive layer formed on the planarizing layer;
- and
- a first insulating layer formed on the planarizing layer such that the first conductive layer is embedded in the first insulating layer,
- wherein a side surface of the first insulating layer has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part, such that a part of the planarizing layer is exposed on the recessed part of the first insulating layer, and
- wherein the substrate comprises silicon single crystal, alumina, sapphire, aluminium nitride, MgO single crystal, SrTiO3 single crystal, surface-oxidized silicon, glass, quartz, or ferrite.
4 more elements
An electronic component comprising:
- a substrate;
- a first conductive layer formed over the substrate;
- a first insulating layer formed over the substrate such that the first conductive layer is embedded in the first insulating layer;
- a second conductive layer formed on the first insulating layer;
- and
- a second insulating layer formed on the first insulating layer such that the second conductive layer is embedded in the second insulating layer,
- wherein a side surface of the first insulating layer has a first recessed part set back from a side surface of the substrate and a first projecting part projecting from the first recessed part, and
- wherein a side surface of the second insulating layer has a second recessed part set back from the side surface of the substrate and a second projecting part projecting from the second recessed part, and
- wherein a projecting amount of the first projecting part from the first recessed part of the first insulating layer is different from a projecting amount of the second projecting part from the second recessed part of the second insulating layer.
6 more elements
Dependencies are inferred from the claim text.