Flexible circuit board including bending part with improved shielding properties and manufacturing method thereof

A flexible circuit board including a bending part with improved shielding properties, the flexible circuit board comprising:

• a first dielectric formed to include a width direction and a length direction;
• a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric;
• a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric;
• a first cover positioned on the first dielectric, while being formed to have a width smaller than a width of the first dielectric;
• a second cover positioned under the first dielectric and overlapping the first cover at least partially in a vertical direction, while being formed to have a width smaller than the width of the first dielectric;
• a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric;
• a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric;
• a first ground positioned on the second dielectric;
• a second ground positioned under the third dielectric;
• a third cover positioned on the first ground;
• a fourth cover positioned under the second ground,
• wherein at least a part of one side of the first cover in the length direction is interposed between the first dielectric and the second dielectric, and a portion of the first cover that is not interposed between the first dielectric and the second dielectric is exposed, and
• wherein at least a part of one side of the second cover in the length direction is interposed between the first dielectric and the third dielectric, and a portion of the second cover that is not interposed between the first dielectric and the third dielectric is exposed;
• and
• a first center ground positioned between the first signal line and the second signal line, and positioned on the upper surface of the first dielectric, wherein the first center ground does not overlap with the first signal line and the second signal line in the vertical direction and wherein the first signal line and the second signal line are directly positioned on the same surface of the first dielectric.