Electronic module with single or multiple components partially surrounded by a thermal decoupling gap

An electronic device, comprising:

• a first component carrier;
• a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier;
• a first component on and/or in the second component carrier;
• a second component having a first main surface at which the second component is mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier;
• and
• a third component in the first component carrier, the first component carrier having a build-up structure surrounding a core layer and a redistribution layer, a first surface of the redistribution layer facing the second component and an opposed surface of the redistribution layer facing the third component,
• wherein respective connections provided by the first surface and the opposed surface are offset,
• wherein the first component carrier comprises vertical through connections configured for removing heat away from the first component and from the second component toward a bottom side of the electronic device.