Camera module and molding circuit board assembly, circuit board and application thereof

A molding circuit board assembly comprising:

• a protecting portion;
• at least one photosensitive chip;
• a molding base, wherein the molding base has at least one light window;
• and
• at least one circuit board,
• wherein the circuit board further comprises a substrate,
• wherein the substrate has at least one chip holding portion, at least one protecting area surrounding the chip holding portion, and at least one bonding area surrounding the protecting area,
• wherein the photosensitive chip is held in the chip holding portion of the substrate,
• wherein the protecting portion is located at least in the protecting area of the substrate for protecting the circuit board and does not cover a wire for connecting the circuit board with the photosensitive chip, and
• wherein the molding base is integrally bonded to the bonding area of the substrate, and the molding base surrounds the photosensitive area of the photosensitive chip such that the photosensitive area of the photosensitive chip corresponds to the light window of the molding base.