Radio-frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorReiji Nakajima
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AssigneeMurata Manufacturing Co., Ltd.
InventorReiji Nakajima
Estimating the term…
A radio-frequency module includes a module substrate; a power amplifier; a first switch connected to an input terminal of the power amplifier; a second switch connected to an output terminal of the power amplifier; and a switch control circuit that controls the first switch and the second switch. The first switch, the second switch, and the switch control circuit are included in a semiconductor IC being integrated into a single chip. The power amplifier and the semiconductor IC are mounted on or above the module substrate. When the module substrate is viewed in a plan view, in the semiconductor IC, the switch control circuit is disposed between the first switch and the second switch.
A radio-frequency module comprising:
A communication device comprising:
A radio-frequency module comprising:
Dependencies are inferred from the claim text.