Power conversion device

Abstract

The power converter A1 includes a semiconductor device B1, and a substrate H on which the semiconductor device B1 is mounted, where the semiconductor device B1 includes a control chip constituting a primary control circuit, a semiconductor chip constituting a secondary power circuit, and a transmission circuit for electrically insulating the primary control circuit and the secondary power circuit and for signal transmission between the primary control circuit and the secondary power circuit. The substrate H has a conductive portion K. The power converter A1 includes a connecting terminal T1 disposed on the substrate H and electrically connected to the conductive portion K. The power converter A1 includes a conductive path D1 that is at least partially formed by the conductive portion K of the substrate H, and that electrically connects the primary control circuit and the connecting terminal T1. Such a configuration contributes to downsizing the power converter A1.

Dependencies are inferred from the claim text.