Localized rework using liquid media soldering

A method for performing a rework operation on an electronic component, the method comprising:

• attaching a top sealing head to a top surface of a printed circuit board (PCB), wherein the top sealing head surrounds an electronic component being reworked and creates a liquid-tight seal with the top surface of the PCB;
• attaching a bottom sealing head to a bottom surface of the PCB, wherein the bottom sealing head is disposed opposite to the top sealing head, the bottom sealing head creating a liquid-tight seal with the bottom surface of the PCB;
• releasing a rework liquid into the top sealing head, wherein the rework liquid is at a temperature that is higher than a melting point of solder used to attach the electronic component to the PCB;
• and
• removing, after the solder has begun melting, the electronic component from the PCB using a mechanical capture device disposed inside of the top sealing head.

A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by processor to cause the processor to perform a method comprising:

• attaching a top sealing head to a top surface of a printed circuit board (PCB), wherein the top sealing head surrounds an electronic component being reworked and creates a liquid-tight seal with the top surface of the PCB;
• attaching a bottom sealing head to a bottom surface of the PCB, wherein the bottom sealing head is disposed opposite to the top sealing head, the bottom sealing head creating a liquid-tight seal with the bottom surface of the PCB;
• releasing a rework liquid into the top sealing head, wherein the rework liquid is at a temperature that is higher than a melting point of solder used to attach the electronic component to the PCB;
• and
• removing, after the solder has begun melting, the electronic component from the PCB using a mechanical capture device disposed inside of the top sealing head.