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US 11,445,637 B2Granted
Electronic device comprising heat radiating structure
AssigneeSamsung Electronics Co., Ltd.
InventorsChung-Hyo Jung, Kang-Sik Kim, Young-San Kim, Won-Min Kim, Chi-Hyun Cho
Life of this patent
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Abstract
According to various embodiments of the present invention, an electronic device can comprise: a circuit board; an electronic component arranged on one surface of the circuit board; a thermal conductive member arranged so as to correspond to the upper surface of the electronic component; and a thermal interface member arranged between the electronic component and the thermal conductive member and comprising a carbon fiber. The electronic device can be variously implemented according to embodiments.
Claims5
An electronic device comprising:
- a circuit board;
- an electric component disposed on one face of the circuit board;
- an electromagnetic shielding member mounted so as to cover at least a portion of the electric component on the one face of the circuit board;
- an opening formed in the shielding member so as to expose a portion of the electric component to an outside of the shielding member;
- a heat transfer member including at least a portion of a flange portion and attached to an outer face of the shielding member to close the opening and connected to the portion of the electric component;
- and
- a support member disposed to face at least a portion of the circuit board,
- wherein the heat transfer member forms an electromagnetic shielding structure together with the shielding member and is fixed in a compressed state between the electric component and the support member,
- wherein the electronic device further comprises:
- an accommodation groove formed in the support member;
- a heat radiation member disposed in the accommodation groove;
- a heat conductive member at least partially disposed between the heat transfer member and the heat radiation member;
- and
- electrically insulating double-sided tape configured to attach the heat conductive member to the support member, and
- wherein the heat radiation member absorbs heat from the heat transfer member, and radiates and releases the heat.
12 more elements
Dependencies are inferred from the claim text.