Vapor chamber, heatsink device, and electronic device

A vapor chamber, comprising:

• a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein;
• a working fluid in the housing;
• a first wick in contact with the vapor flow pass;
• and
• a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet,
• wherein the first wick defines a first liquid flow pass that extends through the first wick in a thickness direction in which the first sheet and the second sheet oppose each other,
• wherein the second wick defines a second liquid flow pass that extends in a plane direction of the second wick that is perpendicular to the thickness direction,
• wherein a first average diameter of the first liquid flow pass when viewed in the thickness direction is smaller than or equal to 75% of a second average diameter of the second liquid flow pass when viewed in the plane direction, and
• wherein the second wick is disposed on the inner wall surface of the first sheet;
• and the vapor chamber further comprises:
• a third wick in contact with the vapor flow pass;
• and
• a fourth wick between the third wick and an inner wall surface of the second sheet.