US 11,445,627 B2Granted

Resin card medium and manufacturing method therefor

AssigneesShoei Printing Co., Ltd., Tomoegawa Co., Ltd.

InventorsTomohiro Nakata, Hideki Moriuchi

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Abstract

A resin card medium which has a substrate having electronic components mounted thereon and has sophisticated flatness and smoothness realized without providing any layer having holes for absorbing thicknesses of the electronic components; and a method for manufacturing a resin card medium. A resin card medium laminated body before pressing is prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper constituted of plastic fibers and plant fibers, and by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers.

Claims23

Dependent claims

A resin card medium comprising:

a substrate having one electronic component or two or more electronic components installed on and protruding out from one side of the substrate;
a plant fiber-containing resin layer being laminated on a surface of the substrate on a side on which the electronic component or electronic components are installed and containing plant fibers, and said plant fiber-containing resin layer only partially covers at least one of the electronic component(s);
a first finishing layer being laminated on a surface of the substrate on a side opposite to the side on which the electronic component or electronic components are installed, and
a second finishing layer is further laminated on the plant fiber-containing resin layer such that the plant fiber-containing resin layer is between the substrate and the second finishing layer,
wherein a percentage of a total of a thickness of the substrate and a thickness or thicknesses of the electronic component or electronic components to a thickness of the card medium is 80% or less.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/649,303Filed 20 Sep 2018
Priority: JP JP2017-18223222 Sep 2017
Published: US 2020/0267864 A120 Aug 2020
Granted: 13 Sep 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification29 codes

B42D 25/36
Identification or security features, e.g. for preventing forgery: comprising special materials
B32B 3/085
Characterised by added members at particular parts: spaced apart pieces on the surface of a layer
B32B 5/02
Layered products characterised by the non- homogeneity or physical structure , i.e. comprising a fibrous, filamentary, particulate or foam…
B32B 27/08
As the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin

Family

US 2020/0267864 A1Pre-grant publication · published 20 Aug 2020
US 11,445,627 B2This patent

From the US filing history. Foreign family members aren’t listed.

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