System and method for high-temperature lamination of printed circuit boards
AssigneeMatrix Electronics Limited
InventorKieran Healy
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Abstract
A method of manufacturing a press pad is disclosed. The method includes: providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film; cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad; and attaching a release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.
Claims7
A method of manufacturing a press pad, the method comprising:
- providing a planar pad having a first surface and a second surface opposite to the first surface and a release film sheet, the release film sheet including a polyimide-based film;
- cleaning the planar pad, the cleaning including electrostatically removing particulates from surfaces of the planar pad;
- and
- attaching the release film sheet to the first surface of the planar pad, the release film sheet being attached to the first surface using an acrylic-based adhesive containing thermoplastic polyolefin and methyl acrylate.
Dependencies are inferred from the claim text.