Flexible circuit board and method for manufacturing same

A method for manufacturing a flexible circuit board comprising:

• providing a first laminated structure, the first laminated structure comprising two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure, the first conductive structure penetrating the two first wiring boards and the first adhesive layer and electrically connecting the two first wiring boards, the first adhesive layer defining a first opening, the first opening comprising a first edge away from the first conductive structure;
• cutting the first laminated structure along the first edge;
• unfolding the two first wiring boards, thereby obtaining the flexible circuit board;
• forming two second laminated structures on opposite sides of the first laminated structure, each of the two second laminated structure comprising a second adhesive layer, a second wiring board stacked on a side of the second adhesive layer, and a second conductive structure, the second conductive structure penetrating the second wiring board and the second adhesive layer and electrically connecting the second wiring board and one of the two first wiring boards, the second conductive structure corresponding in position to the first opening, the second adhesive layer defining a second opening, the first conductive structure corresponding in position to the second opening, the second opening comprising a second edge away from the second conductive structure;
• cutting the two second laminated structures along the first edge and cutting the two second laminated structures and the first laminated structure along the second edge;
• and
• unfolding two wiring boards of the two second laminated structures.