Component carrier with a dielectric element placed in a cavity and a manufacturing method
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsPatrick Lenhardt, Sebastian Wolfgang Sattler
Life of this patent
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Abstract
A component carrier including: i) a layer stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure, ii) a cavity formed in the layer stack, iii) a dielectric element at least partially placed in the cavity, wherein the dielectric element and the layer stack are electromagnetically couple-able, and iv) an electrically insulating connection material between the dielectric element and the layer stack.
Claims19
A component carrier, comprising:
- a layer stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure;
- a cavity formed in the layer stack;
- a dielectric element at least partially placed in the cavity, wherein the dielectric element and the layer stack are electromagnetically couple-able;
- and
- an electrically insulating connection material in the cavity between the dielectric element and the layer stack;
- wherein the electromagnetic coupling is between a transmission line and the dielectric element and comprises a transmission of an electromagnetic wave by at least one of capacitive coupling and inductive coupling.
An electronic device, comprising:
- a component carrier including a layer stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure;
- a cavity formed in the layer stack;
- a dielectric element at least partially placed in the cavity,
- wherein the dielectric element and the layer stack are electromagnetically couple-able;
- an electrically insulating connection material in the cavity between the dielectric element and the layer stack;
- and
- at least one functionality of the group which consists of:
- a 4G functionality, a 5G functionality, a mm-wave guide functionality, a WiFi functionality, an antenna functionality, a radar functionality, a filter functionality, an RF/HF coupling functionality;
- wherein the electromagnetic coupling comprises a transmission of an electromagnetic wave by at least one of capacitive coupling and inductive coupling.
A method of manufacturing a component carrier, comprising:
- forming a layer stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure;
- forming a cavity in the layer stack;
- arranging an electrically insulating connection material in the cavity of the layer stack;
- placing a dielectric element at least partially in the cavity such that the electrically insulating connection material is between the dielectric element and the layer stack;
- and
- electromagnetically coupling the dielectric element and the layer stack,
- wherein the electromagnetic coupling comprises a transmission of an electromagnetic wave by at least one of capacitive coupling and inductive coupling.
A method, comprising:
- arranging an electrically insulating connection material in a cavity of a component carrier layer stack between a dielectric element and the component carrier layer stack;
- using the dielectric element, being at least partially embedded in the cavity of the component carrier layer stack, the dielectric element establishing at least one of a capacitive coupling and an inductive coupling of electromagnetic waves with at least one electrically conductive layer structure of said layer stack.
Dependencies are inferred from the claim text.