Component carrier and method of manufacturing a component carrier

A method of manufacturing a component carrier, comprising:

• forming a stack comprising at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure;
• configuring the first electrically insulating layer structure of a material having first physical properties;
• configuring the second electrically insulating layer structure of another material having second physical properties differing from the first physical properties;
• arranging the first electrically insulating layer structure and the second electrically insulating layer structure at least partially in direct physical contact with each other;
• and
• embedding a component in the stack;
• wherein the second electrically insulating layer structure directly surrounds at least part of the component;
• wherein the second electrically insulating layer structure has a shell at least partially surrounding the component.