Printed circuit board and antenna module comprising the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong Min, Ju Ho Kim
Life of this patent
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Abstract
A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.
Claims18
A printed circuit board comprising:
- a first stacked body having a flexible region and a rigid region;
- and
- a second stacked body disposed on one side of the rigid region of the first stacked body,
- wherein the first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers,
- the second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers,
- each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers, and
- an antenna is disposed directly on the first stacked body.
An antenna module comprising:
- a printed circuit board including a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body;
- and
- an antenna disposed on a side of the first stacked body opposite to a side on which the second stacked body is disposed,
- wherein the first stacked body comprises a first insulating layer,
- the second stacked body comprises a second insulating layer, and
- a dielectric constant of the first insulating layer is higher than a dielectric constant of the second insulating layer.
A printed circuit board comprising:
- a first stacked body including a flexible region and a rigid region, the first stacked body including a plurality of insulating layers that are stacked together with wiring layers therebetween and that extend across both the flexible and rigid regions;
- and
- a second stacked body stacked on the rigid region of the first stacked body, the second stacked body including a plurality of insulating layers that are stacked together with wiring layers therebetween and that extend across only the rigid region from among the rigid and flexible regions,
- wherein each of the insulating layers that extends across the flexible and rigid regions has a composition different from each of the insulating layers that extends across only the rigid region from among the flexible and rigid regions, and
- wherein each of the insulating layers that extends across the flexible and rigid regions has at least one of a higher dielectric constant (Dk) or a lower dielectric dissipation factor (Df) than each of the insulating layers that extends across only the rigid region from among the flexible and rigid regions.
Dependencies are inferred from the claim text.