Circuit board having heat-dissipation block and method of manufacturing the same

A circuit board, comprising:

• an open substrate having a thickness, comprising:
• a substrate body having a top surface and a bottom surface;
• an opening in the substrate body, wherein the opening has a first sidewall and a second sidewall opposite to the first sidewall;
• at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, wherein the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall and have a height smaller than the thickness of the open substrate, wherein the first fixing portion and the second fixing portion comprise a conductive layer;
• and
• an aperture on the first fixing portion and the second fixing portion along a thickness direction of the open substrate;
• and
• a heat dissipation block directly clamped between the first fixing portion and the second fixing portion and in contact with the conductive layer, wherein the heat dissipation block includes ceramic or a composite material.