Airwaves-passing-type heat dissipation sheet and communication module comprising same
AssigneeLG Innotek Co., Ltd.
InventorsYeo Eun Yoon, Seok Bae
Life of this patent
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AssigneeLG Innotek Co., Ltd.
InventorsYeo Eun Yoon, Seok Bae
Estimating the term…
The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 μm, a D10 of 10 to 25 μm, and a D90 of 75 to 85 μm, and the θ50 of the flat boron nitride is arranged to form an angle of 40° or less with horizontal components of the sheet layer.
A communication module comprising:
A sheet layer comprising:
Dependencies are inferred from the claim text.