High performance stacked connector
AssigneeFci USA LLC
InventorsJason Si, Ba Pham, Xingye Chen, Sam Kocsis
Life of this patent
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AssigneeFci USA LLC
InventorsJason Si, Ba Pham, Xingye Chen, Sam Kocsis
Estimating the term…
A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.
A stacked connector, comprising:
A method of operating an electronic device comprising:
A stacked connector of the type having a mounting face and a mating face perpendicular to the mounting face and sides perpendicular to both the mating face and the mounting face, the connector comprising:
A stacked connector of the type having a mounting face and a mating face perpendicular to the mounting face and sides perpendicular to both the mating face and the mounting face, the connector comprising:
Dependencies are inferred from the claim text.