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US 11,444,365 B2Granted
Radio-frequency (RF)-interface and modular plate
AssigneeRaytheon Company
InventorsJames Benedict, Erika Klek, John P. Haven, Michael Souliotis, Thomas V. Sikina, Andrew R. Southworth, Kevin Wilder
Life of this patent
Estimating the term…
Abstract
A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.
Claims16
A radio frequency (RF) assembly, comprising:
- an RF panel comprising a microstrip interface, the microstrip interface comprising a ground-signal configuration;
- a plate comprising a stripline interface, the stripline interface comprising a ground-signal-ground configuration;
- a microstrip-to-stripline transition element, which comprises a ground-signal-ground configuration that is curvilinear, operably connectable to the microstrip interface and to the stripline interface;
- and
- an additional chip element interposed between an upper surface of the RF panel and a lower surface of the plate,
- wherein:
- the microstrip and stripline interfaces are axially offset from one another with the microstrip-to-stripline transition element having an inflective curve between the microstrip and stripline interfaces,
- an upper ground conductor of the ground-signal-ground configuration of the microstrip-to-stripline transition element terminates at a side of the additional chip element facing the inflective curve, and
- the ground-signal configuration of the microstrip interface extends between the additional chip element and the RF panel.
6 more elements
A radio frequency (RF) assembly, comprising:
- an RF panel having an upper surface and comprising a microstrip interface at the upper surface;
- a plate having a lower surface and comprising a stripline interface at the lower surface;
- a microstrip-to-stripline transition element, which has a ground-signal-ground configuration which is curvilinear, having first and second ends and being operably connected at the first end thereof to the microstrip interface at the upper surface of the RF panel and at the second end thereof to the stripline interface at the lower surface of the plate;
- and
- an additional chip element interposed between the upper surface of the RF panel and the lower surface of the plate,
- wherein:
- the microstrip and stripline interfaces are axially offset from one another with the microstrip-to-stripline transition element having an inflective curve between the microstrip and stripline interfaces,
- an upper ground conductor of the ground-signal-ground configuration of the microstrip-to-stripline transition element terminates at a side of the additional chip element facing the inflective curve, and
- the ground-signal configuration of the microstrip interface extends between the additional chip element and the RF panel.
6 more elements
A radio frequency (RF) assembly, comprising:
- an RF panel having an upper surface and comprising a microstrip interface at the upper surface;
- a plate having a lower surface and comprising a stripline interface at the lower surface;
- and
- a microstrip-to-stripline transition element comprising:
- a first end operably connected to the microstrip interface at the upper surface of the RF panel;
- a second end operably connected to the stripline interface at the lower surface of the plate;
- a section which has a ground-signal-ground configuration that is curvilinear and which is connected to the first and second ends;
- and
- an additional chip element interposed between the upper surface of the RF panel and the lower surface of the plate,
- wherein:
- the microstrip and stripline interfaces are axially offset from one another with the microstrip-to-stripline transition element having an inflective curve between the microstrip and stripline interfaces,
- an upper ground conductor of the ground-signal-ground configuration of the microstrip-to-stripline transition element terminates at a side of the additional chip element facing the inflective curve, and
- a ground-signal configuration of the microstrip interface extends between the additional chip element and the RF panel.
10 more elements
Dependencies are inferred from the claim text.