US 11,444,244 B2Granted

Mask plate and fabrication method thereof

AssigneeNingbo Semiconductor International Corporation

InventorsMengbin Liu, Hailong Luo

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Abstract

The present disclosure provides a mask plate and fabrication method thereof. The mask plate includes a substrate, having a first surface and a second surface, and containing a plurality of openings. The mask plate also includes a mask pattern layer, formed on the first surface of the substrate and including a plurality of pattern regions and a shield region surrounding the plurality of pattern regions. Each pattern region includes at least one through hole, and each opening formed in the substrate exposes a pattern region and the at least one through hole in the pattern region. The mask plate further includes a top substrate layer, formed on the mask pattern layer. The top substrate layer contains a plurality of grooves passing through the top substrate layer, and each groove exposes a pattern region in the mask pattern layer and exposes the at least one through hole in the pattern region.

Claims5

Dependent claims

A mask plate, comprising:

a substrate, having a first surface and a second surface opposite to the first surface, wherein the substrate contains an opening passing through the substrate;
a mask pattern layer, formed on the first surface of the substrate and including a pattern region and a shield region surrounding the pattern region, wherein the pattern region includes at least one through hole, and the opening formed in the substrate exposes the pattern region and the at least one through hole in the pattern region;
a top substrate layer, formed on the mask pattern layer, wherein the top substrate layer contains a groove passing there-through, and the groove formed in the top substrate layer exposes the pattern region in the mask pattern layer and exposes the at least one through hole in the pattern region;
and
a protective layer, formed on the top substrate layer and containing a trench formed through the protective layer to connect to the groove, wherein the protective layer is a topmost layer of the mask plate.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/209,862Filed 4 Dec 2018 · continuation
Priority: CN 201810354999.819 Apr 2018
Published: US 2019/0326514 A124 Oct 2019
Granted: 13 Sep 2022
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

C23C 14/042
Coating on selected surface areas, e.g. using masks: using masks
C23C 16/042
Coating on selected surface areas, e.g. using masks: using masks
C23F 1/02
Etching metallic material by chemical means: local etching
H10K 71/164
Using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering: using vacuum deposition

Family

PCT/CN2018/094246Parent of this continuation · filed 3 Jul 2018
US 2019/0326514 A1Pre-grant publication · published 24 Oct 2019
US 11,444,244 B2This patent

From the US filing history. Foreign family members aren’t listed.

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