Light emitting diode package with substrate configuration having enhanced structural integrity
AssigneeDominant Opto Technologies Sdn Bhd.
InventorsTek Beng Low, Eng Wah Tan, Chee Sheng Lim
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Abstract
A light emitting diode package including: a housing, wherein the housing has a first axis defined as a width (w), and a second axis defined as a height (h); a lead frame associated with the housing, wherein the lead frame includes a first electrode and a second electrode; wherein the first electrode and the second electrode are spaced apart from each other to define an inter-digit region therebetween, wherein the inter-digit region comprises a length (l) that is offset (e.g., not parallel) relative to the width and/or height of the housing.
Claims17
A light emitting diode package, comprising:
- a housing, wherein the housing comprises a first axis defined as a width, and a second axis defined as a height;
- a lead frame positioned at least partially within the housing, wherein the lead frame comprises a first electrode and a second electrode;
- wherein a portion of the first electrode and a portion of the second electrode within the housing are spaced apart from each other to define an inter-digit region therebetween, and wherein the inter-digit region is within the housing and comprises a length;
- and
- wherein the length of the inter-digit region is offset relative to at least one of the width and the height of the housing.
A light emitting diode package, comprising:
- a housing, wherein the housing comprises a first axis defined as a width, and a second axis defined as a height;
- a lead frame positioned at least partially within the housing, wherein the lead frame comprises a first electrode and a second electrode;
- wherein a portion of the first electrode and a portion of the second electrode within the housing are spaced apart from each other to define an inter-digit region therebetween, and wherein the inter-digit region is within the housing and comprises a length;
- wherein the length of the inter-digit region is offset relative to at least one of the width and the height of the housing;
- and
- an inter-digit configuration formed by the first electrode and the second electrode for increasing the structural integrity of the light emitting diode package.
Dependencies are inferred from the claim text.