Semiconductor device including first and second buffer layers
AssigneeMitsubishi Electric Corporation
InventorsKenji Suzuki, Koichi Nishi, Katsumi Nakamura
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Electric Corporation
InventorsKenji Suzuki, Koichi Nishi, Katsumi Nakamura
Estimating the term…
An object is to provide a technique of improving productivity of a semiconductor device. A first buffer layer includes a first portion located in a thickness direction of a semiconductor substrate from a main surface and having a first peak of an N type impurity concentration and a second portion located farther away from the main surface than the first portion and having a second peak of an N type impurity concentration. A distance from the main surface to the first portion is equal to or smaller than 4.0 μm, and a distance from the first portion to the second portion is equal to or larger than 14.5 μm. An N type impurity concentration of a portion between the first portion and the second portion is higher than an N type impurity concentration of a drift layer.
A semiconductor device, comprising
Dependencies are inferred from the claim text.