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US 11,444,111 B2Granted
Image sensor package having a light blocking member
AssigneeSemiconductor Components Industries, LLC
InventorsYu-Te Hsieh, I-Lin Chu
Life of this patent
Estimating the term…
Abstract
According to an aspect, an image sensor package includes a substrate, an image sensor die coupled to the substrate, and a transparent member including a first surface and a second surface, where the second surface of the transparent member is coupled to the image sensor die via one or more dam members such that an empty space exists between an active area of the image sensor die and the second surface of the transparent member. The image sensor package includes a light blocking member coupled to or defined by the transparent member.
Claims19
An image sensor package comprising:
- a substrate having a surface disposed within a plane;
- an image sensor die coupled to the substrate, the image sensor die including an active area;
- a light transmitting member including a first surface and a second surface, the second surface of the light transmitting member being coupled to the image sensor die via one or more dam members such that an empty space exists between the active area of the image sensor die and the second surface of the light transmitting member, the light transmitting member including a first edge and a second edge, the first edge and the second edge being perpendicular to the surface of the substrate;
- an encapsulation material;
- and
- a light blocking member including a first portion, an entirety of the first portion being coupled directly to the light transmitting member, the first portion extending to the first edge, the light blocking member including a second portion coupled directly to the light transmitting member and extending to the second edge, the light blocking member including a third portion directly contacting a top surface of the encapsulation material, the first portion having a length greater than a length of a dam member in a first direction, the first direction being aligned parallel to the plane.
3 more elements
An image sensor package comprising:
- a substrate having a surface disposed within a plane;
- an image sensor die coupled to the substrate, the image sensor die including an active area;
- a light transmitting member including a first surface and a second surface, the second surface of the light transmitting member being coupled to the image sensor die via a first dam member and a second dam member such that an empty space exists between the active area of the image sensor die and the second surface of the light transmitting member, the light transmitting member including a first edge and a second edge, the first edge and the second edge being aligned perpendicular to the surface of the substrate;
- at least one bond wire connected to the substrate and the image sensor die;
- an encapsulation material that encapsulates the at least one bond wire, the encapsulation material including a first outer edge coupled to the substrate and a second outer edge extending from the first outer edge, the second outer edge being coupled to the light transmitting member, the second outer edge being aligned non-parallel and non-perpendicular to the first outer edge;
- and
- a light blocking member including a first portion directly coupled to the light transmitting member and extending to the first edge, the light blocking member including a second portion coupled directly to the light transmitting member and extending to the second edge, the light blocking member including a third portion directly contacting the second outer edge of the encapsulation material, the first portion having a length greater than a length of the first dam member in a first direction, the first direction being aligned parallel to the plane, the light blocking member not being coupled to the first outer edge of the encapsulation material.
4 more elements
Dependencies are inferred from the claim text.