Semiconductor device and method for manufacturing same

A semiconductor device comprising:

• a protected element that is configured to include a p-n junction diode between an anode region and a cathode region, and arranged in an active layer of a substrate including the active layer formed over a substrate-support with an insulation layer interposed between the active layer and the substrate-support;
• an element isolation region that is arranged in the active layer so as to surround a periphery of the p-n junction diode and to electrically isolate the p-n junction diode from an element arranged at the periphery of the p-n junction diode;
• a contact region that is arranged at a portion on a main face of the anode region, set with a same conductivity type as the anode region, and set with a higher impurity concentration than the anode region;
• and
• a shield region that is arranged between the cathode region and the contact region so as to extend from the main face of the anode region as far as a region deeper than a depth of the contact region and shallower than the anode region, and configured to include a semiconductor region with an opposite conductivity type to the anode region,
• wherein the element isolation region includes:
• a trench extending from a surface of the active layer at least as far as the insulation layer,
• an insulation body arranged at side walls of the trench, and
• a conductor arranged at side walls of the trench with the insulation body interposed between the side walls of the trench and the conductor;
• and
• wherein the shield region extends along between the cathode region and the contact region, and is arranged such that both extension direction ends of the shield region contact the element isolation region.