Semiconductor element mounting structure, and combination of semiconductor element and substrate

A combination of a semiconductor element and a substrate, comprising:

• the semiconductor element comprising an element electrode, and the substrate comprising a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, wherein:
• one of the element electrode or the substrate electrode is a protruding electrode comprising a solder layer at a tip portion thereof,
• the other of the element electrode or the substrate electrode is an electrode pad comprising one or more metal protrusions on a surface thereof, and
• a bottom area of each of the one or more metal protrusions is 70% or less with respect to a maximum cross-sectional area of the solder layer of the protruding electrode;
• and
• at least one further semiconductor element provided facing the semiconductor element at an opposite side of the semiconductor element from the side facing the substrate, wherein:
• one of an element electrode of the semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate or an element electrode of the other further semiconductor element is a second protruding electrode comprising a solder layer at a tip portion thereof,
• the other of the element electrode of the semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate or the element electrode of the other further semiconductor element is a second electrode pad comprising one or more metal protrusions on a surface thereof, and
• a bottom area of each of the one or more metal protrusions of the second electrode pad is 70% or less with respect to a maximum cross-sectional area of the solder layer of the second protruding electrode.

A semiconductor element mounting structure, comprising:

• a semiconductor element comprising an element electrode, and a substrate comprising a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, the semiconductor element and the substrate being connected via the element electrode and the substrate electrode, wherein:
• one of the element electrode or the substrate electrode is a first protruding electrode comprising a solder layer at a tip portion thereof,
• the other of the element electrode or the substrate electrode is a first electrode pad comprising one or more metal protrusions on a surface thereof,
• the one or more metal protrusions of the first electrode pad extend into the solder layer of the first protruding electrode, and
• a bottom area of each of the one or more metal protrusions of the first electrode pad is 70% or less with respect to an area of the first electrode pad;
• and and
• at least one further semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate, the at least one further semiconductor element being layered in a state such that each semiconductor element is connected via an element electrode, wherein:
• one of an element electrode of the semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate or an element electrode of the other further semiconductor element is a second protruding electrode comprising a solder layer at a tip portion thereof,
• the other of the element electrode of the semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate or the element electrode of the other further semiconductor element is a second electrode pad comprising one or more metal protrusions on a surface thereof,
• the one or more metal protrusions of the second electrode pad extend into the solder layer of the second protruding electrode, and
• a bottom area of each of the one or more metal protrusions of the second electrode pad is 70% or less with respect to an area of the second electrode pad.

A combination of a semiconductor element and a substrate, comprising:

• the semiconductor element comprising an element electrode, and the substrate comprising a substrate electrode that is provided on a surface facing the semiconductor element at a position facing the element electrode, wherein:
• one of the element electrode or the substrate electrode is a protruding electrode comprising a solder layer at a tip portion thereof,
• the other of the element electrode or the substrate electrode is an electrode pad comprising one or more metal protrusions on a surface thereof, and
• a bottom area of each of the one or more metal protrusions is 70% or less with respect to an area of the electrode pad;
• and
• at least one further semiconductor element provided facing the semiconductor element at an opposite side of the semiconductor element from the side facing the substrate, wherein:
• one of an element electrode of the semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate or an element electrode of the other further semiconductor element is a second protruding electrode comprising a solder layer at a tip portion thereof,
• the other of the element electrode of the semiconductor element provided at an opposite side of the semiconductor element from the side facing the substrate or the element electrode of the other further semiconductor element is a second electrode pad comprising one or more metal protrusions on a surface thereof, and
• a bottom area of each of the one or more metal protrusions of the second electrode pad is 70% or less with respect to an area of the second electrode pad.