Electronic component module, method for producing the same, endoscopic apparatus, and mobile camera

An endoscope that comprises an image sensor module including:

• a substrate that includes an electrode array;
• an image sensor that includes an electrode array;
• and
• a connection device that includes a plurality of post parts including respective conductive parts and a base for supporting the plurality of post parts, that is interposed between the substrate and the image sensor, and that is configured in a manner that the conductive parts electrically connect the electrode array of the substrate and the electrode array of the image sensor to each other via solder, wherein at least one of the post parts includes a first step part that is formed like a step from the base and that extends from a first surface side of the base, wherein a first protrusion part extends from the first step part, wherein the at least one of the post parts includes a second step part that is formed like a step from the base and that extends from a second surface side of the base, and wherein a second protrusion part extends from the second step part.

A method for producing an electronic component module, the method comprising:

• forming a connection device that includes a plurality of post parts including respective conductive parts and a base for supporting the plurality of post parts, wherein at least one of the post parts includes a first step part that is formed like a step from the base and that extends from a first surface side of the base, wherein a first protrusion part extends from the first step part, wherein the at least one of the post parts includes a second step part that is formed like a step from the base and that extends from a second surface side of the base, and wherein a second protrusion part extends from the second step part;
• and
• electrically connecting an electrode array of a substrate and an electrode array of an electronic component to each other via solder by using the conductive parts of the connection device, wherein the forming the connection device includes:
• forming a conductive film on a base substance;
• and
• forming the conductive parts and the post parts including the conductive parts by removing a portion of the conductive film through cutting of the base substance on which the conductive film is formed.

A method for producing an electronic component module, the method comprising:

• forming a connection device that includes a plurality of post parts including respective conductive parts and a base for supporting the plurality of post parts, wherein at least one of the post parts includes a first step part that is formed like a step from the base and that extends from a first surface side of the base, wherein a first protrusion part extends from the first step part, wherein the at least one of the post parts includes a second step part that is formed like a step from the base and that extends from a second surface side of the base, and wherein a second protrusion part extends from the second step part;
• and
• electrically connecting an electrode array of a substrate and an electrode array of an electronic component to each other via solder by using the conductive parts of the connection device, wherein the forming the connection device includes:
• forming the base and main bodies of the post parts through injection molding in a manner that the main bodies protrude from a surface of the base;
• and
• forming the respective conductive parts on the formed main bodies.