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US 11,444,047 B2Granted
Semiconductor device
AssigneeDenso Corporation
InventorTakanori Kawashima
Life of this patent
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Abstract
A semiconductor device disclosed herein may include: a semiconductor element including an electrode on a surface of the semiconductor element; and a terminal bonded to the electrode via a bonding material, wherein the electrode may include a protrusion portion that protrudes toward the terminal and is in contact with the bonding material.
Claims15
A semiconductor device comprising:
- a semiconductor element comprising a first main surface, a first electrode on the first main surface, and a second electrode on the first main surface, a surface of the second electrode being smaller than a surface of the first electrode;
- a first conductor plate bonded to the surface of the first electrode via a first bonding material;
- and
- a terminal bonded to the surface of the second electrode via a second bonding material,
- wherein
- the second electrode comprises a protrusion portion on the surface of the second electrode that protrudes toward the terminal and is in contact with the second bonding material, and
- a distance between the protrusion portion and the terminal is smaller than a distance between the first electrode and the first conductor plate.
4 more elements
Dependencies are inferred from the claim text.