Bonding structures of semiconductor devices
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsRamasamy Chockalingam, Juan Boon Tan, Xiaodong Li, Kai Chong Chan, Ranjan Rajoo
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Abstract
A semiconductor device is provided that includes a bond pad, an insulating layer, and a bonding structure. The bond pad is in a dielectric layer and the insulating layer is over the bond pad; the insulating layer having an opening over the bond pad formed therein. The bonding structure electrically couples the bond pad in the opening. The bonding structure has a height that at least extends to an upper surface of the insulating layer.
Claims20
A semiconductor device comprising:
- a bond pad in a dielectric layer;
- a passivation layer over the dielectric layer and the bond pad;
- an insulating layer over the passivation layer;
- a bonding structure through the passivation layer and the insulating layer, wherein the bonding structure has a height that at least extends to an upper surface of the insulating layer and is electrically coupled with the bond pad;
- and
- a dielectric barrier liner over an upper surface of the bonding structure.
A method of forming a semiconductor device, comprising:
- forming a bond pad formed in a dielectric layer;
- forming a passivation layer over the dielectric layer and the bond pad;
- forming an insulating layer over the passivation layer;
- forming an opening in the passivation layer and the insulating layer to expose the bond pad;
- forming a bonding structure in the opening electrically coupling the bond pad, wherein the bonding structure has a height that at least extends to an upper surface of the insulating layer;
- and
- forming a dielectric barrier liner over an upper surface of the bonding structure.
A semiconductor device comprising:
- a bond pad in a dielectric layer;
- a passivation layer over the dielectric layer and the bond pad;
- an insulating layer over the passivation layer, the insulating layer having an upper surface;
- an opening through the passivation layer and the insulating layer, the opening exposes the bond pad;
- a bonding structure having a uniform material composition in the opening, wherein the bonding structure at least fills to the top of the opening with a height that at least extends to the upper surface of the insulating layer and is electrically coupled with the bond pad;
- and
- a barrier liner over the bonding structure.
Dependencies are inferred from the claim text.