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US 11,444,043 B2Granted
Substrate having embedded electronic component
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHong In Kim, Thomas A Kim, Tae Sung Jeong
Life of this patent
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Abstract
Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
Claims20
A substrate having an electronic component, comprising:
- a frame having a through hole, wherein the electronic component is disposed in the through hole;
- a first wiring portion, formed on a surface of the frame and the electronic component, comprising a first insulating layer and a wiring layer;
- a first layer, formed on an outer surface of the first wiring portion, comprising a via extending from a top surface of the first layer to a bottom surface of the first layer;
- and
- a second wiring portion, formed on the first layer, comprising an antenna layer,
- wherein the via directly connects a pattern layer of the first wiring portion in contact with the bottom surface of the first layer to the antenna layer in contact with the top surface of the first layer, and;
- wherein the first layer has a thickness greater than that of the first wiring portion formed of a single layer.
4 more elements
A substrate having an electronic component, comprising:
- a frame having a through hole, wherein the electronic component is disposed in the through hole;
- a first wiring portion, formed on a surface of the frame and the electronic component, comprising a first insulating layer and a first wiring layer;
- a first layer, formed on an outer surface of the first wiring portion, comprising a via extending from a top surface of the first layer to a bottom surface of the first layer;
- a second wiring portion, formed on the first layer, comprising an antenna layer, wherein a second insulating layer is formed on another surface of the frame and the electronic component;
- and
- a via member connecting an electrode pad formed in the second insulating layer to the electronic component,
- wherein the via directly connects a pattern layer of the first wiring portion in contact with the bottom surface of the first layer to the antenna layer in contact with the top surface of the first layer, and
- wherein the first layer has a thickness greater than that of the first wiring portion formed of a single layer.
5 more elements
A substrate having an electronic component, comprising:
- a frame having a through hole, wherein the electronic component is disposed in the through hole;
- a first wiring portion, formed on a surface of the frame and the electronic component, comprising a first insulating layer and a first wiring layer;
- a first layer, formed on a surface of the first wiring portion, comprising a via extending from a top surface of the first layer to a bottom surface of the first layer;
- a second wiring portion, formed on the first layer, comprising an antenna layer, wherein a second insulating layer is formed on another surface of the frame and the electronic component;
- and
- a via member connecting an electrode pad formed in the second insulating layer to the electronic component,
- wherein the via directly connects a pattern layer of the first wiring portion in contact with the bottom surface of the first layer to the antenna layer in contact with the top surface of the first layer,
- wherein the first layer has a thickness greater than that of the first wiring portion formed of a single layer,
- the first layer excludes portions of the first wiring portion.
6 more elements
Dependencies are inferred from the claim text.