Back to results
US 11,444,042 B2Granted
Magnetic structures in integrated circuit packages
AssigneeIntel Corporation
InventorsAndrew James Brown, Ying Wang, Chong Zhang, Lauren Ashley Link, Yikang Deng
Life of this patent
Estimating the term…
Abstract
Disclosed herein are magnetic structures in integrated circuit (IC) package supports, as well as related methods and devices. For example, in some embodiments, an IC package support may include a conductive line and a magnetic structure around a top surface of the conductive line and side surfaces of the conductive line. The magnetic structure may have a tapered shape that narrows toward the conductive line.
Claims18
An integrated circuit (IC) package support, comprising:
- a conductive line;
- and
- a magnetic structure on a top surface and on side surfaces of the conductive line, wherein the magnetic structure has a rounded portion at a top surface of the magnetic structure.
An electronic assembly, comprising:
- an integrated circuit (IC) package support, including a magnetic structure on a top surface and on side surfaces of a conductive line, wherein the magnetic structure has a rounded portion at a top surface of the magnetic structure.
An integrated circuit (IC) package, comprising:
- a package substrate including an air core inductor, wherein the air core inductor includes a conductive line and a magnetic structure on a top surface and on side surfaces of a conductive line, wherein the magnetic structure has a rounded portion at a top surface of the magnetic structure;
- and
- one or more dies coupled to the package substrate.
Dependencies are inferred from the claim text.