Process of realization of an area of individualization of an integrated circuit

A method for producing an individualisation area on an integrated circuit, the integrated circuit being intended to comprise at least:

• a first and a second level of electrical tracks,
• an interconnection level located between the first and second levels of the electrical tracks and including vias intended to electrically connect the electrical tracks of the first level with electrical tracks of the second level,
• the method comprising at least the following steps:
• providing at least the first level of the electrical tracks, then providing the interconnection level comprising the vias,
• depositing at least one deformable layer and one dielectric layer on the interconnection level,
• producing, in an area of the deformable layer intended to comprise the individualisation area, recessed patterns, by penetrating an imprint mould into the deformable layer, the production of the recessed patterns being configured so that the patterns have a randomness in the deformable layer, thus forming random patterns and that at least some random patterns extend in line with at least two vias of the interconnection level,
• transferring the random patterns into the dielectric layer to form transferred random patterns therein and exposing the vias located in line with the transferred random patterns,
• filling the transferred random patterns with an electrically conductive material so as to form electrical connections between vias,
• producing the second level of the electrical tracks on the vias and the electrical connections,
• and said production of the patterns so that the patterns have a randomness in the deformable layer, comprises the following steps:
• providing said imprint mould, said mould having a front face carrying initial reliefs,
• achieving a random collapse of the initial reliefs so as to form random reliefs,
• penetrating the front face of the mould into the deformable layer to leave the random patterns therein,
• the step of achieving the random collapse of the initial reliefs of the mould being carried out before and/or during the penetration of the front face of the mould into the deformable layer.