Semiconductor device with partial EMI shielding removal using laser ablation
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsChangOh Kim, KyoWang Koo, SungWon Cho, BongWoo Choi, JiWon Lee
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Abstract
A semiconductor device has a substrate. A first component and second component are disposed over the substrate. The first component includes an antenna. A lid is disposed over the substrate between the first component and second component. An encapsulant is deposited over the substrate and lid. A conductive layer is formed over the encapsulant and in contact with the lid. A first portion of the conductive layer over the first component is removed using laser ablation.
Claims25
A method of making a semiconductor device, comprising:
- providing a semiconductor package comprising an encapsulant and an electromagnetic interference (EMI) shield exposed from the encapsulant;
- forming a conductive layer over the encapsulant and in contact with the EMI shield;
- removing a first portion of the conductive layer using a first laser ablation process;
- and
- removing a second portion of the conductive layer using a second laser ablation process.
A method of making a semiconductor device, comprising:
- providing a semiconductor package;
- forming a conductive layer over the semiconductor package;
- removing a first portion of the conductive layer using a first laser ablation process;
- and
- removing a second portion of the conductive layer using a second laser ablation process.
A method of making a semiconductor device, comprising:
- providing a semiconductor package comprising an encapsulant and an electromagnetic interference (EMI) shield exposed from the encapsulant;
- forming a conductive layer over the encapsulant and in contact with the EMI shield;
- removing a first portion of the conductive layer using laser ablation;
- and
- removing a second portion of the conductive layer using laser ablation.
A method of making a semiconductor device, comprising:
- providing a semiconductor package;
- forming a conductive layer over the semiconductor package;
- removing a first portion of the conductive layer using laser ablation;
- and
- removing a second portion of the conductive layer using laser ablation.
Dependencies are inferred from the claim text.