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US 11,444,034 B2Granted
Redistribution structure for integrated circuit package and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, An-Jhih Su, Der-Chyang Yeh, Li-Hsien Huang, Ming Shih Yeh
Life of this patent
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Abstract
A redistribution structure for a semiconductor device and a method of forming the same are provided. The semiconductor device includes a die encapsulated by an encapsulant, the die including a pad, and a connector electrically connected to the pad. The semiconductor device further includes a first via in physical contact with the connector. The first via is laterally offset from the connector by a first non-zero distance in a first direction. The first via has a tapered sidewall.
Claims20
A semiconductor device comprising:
- a die encapsulated by an encapsulant, the die comprising a first pad, a second pad, a third pad, and a fourth pad;
- a first connector electrically connected to the first pad;
- a second connector electrically connected to the second pad;
- a third connector electrically connected to the third pad;
- a fourth connector electrically connected to the fourth pad;
- a first via in physical contact with the first connector, the first via being laterally offset from the first connector by a first non-zero distance in a first direction, the first via having a tapered sidewall;
- a second via in physical contact with the second connector, the second via being laterally offset from the second connector by a second non-zero distance in a second direction different from the first direction;
- a third via in physical contact with the third connector, the third via being laterally offset from the third connector by a third non-zero distance in a third direction different from the first direction and the second direction;
- and
- a fourth via in physical contact with the fourth connector, the fourth via fully landing on the fourth connector.
7 more elements
A semiconductor device comprising:
- a die embedded in an encapsulant, the die comprising a first pad, a second pad, a third pad, and a fourth pad;
- a first connector physically connected to the first pad;
- a second connector physically connected to the second pad;
- a third connector physically connected to the third pad;
- and
- a redistribution structure physically coupled to the first connector, the second connector and the third connector, wherein a first via of the redistribution structure is physically connected to a top surface of the first connector, the first via laterally extending beyond an edge of the first connector in a first direction, the first via having a tapered sidewall, wherein a second via of the redistribution structure is physically connected to a top surface of the second connector, the second via laterally extending beyond an edge of the second connector in a second direction different from the first direction, and wherein a third via of the redistribution structure is physically connected to a top surface of the third connector, the third via laterally extending beyond an edge of the third connector in a third direction different from the first direction and the second direction.
3 more elements
A semiconductor device comprising:
- a first die embedded in an encapsulant, the first die comprising a first connector and a second connector, wherein a first width of the first connector is greater than a second width of the second connector;
- a second die embedded in the encapsulant adjacent the first die, the second die comprising a third connector and a fourth connector;
- and
- a redistribution structure over and electrically coupled to the first die and the second die, wherein a first via of the redistribution structure is in physical contact with a top surface of the first connector and fully overlaps with the first connector in a plan view, wherein a second via of the redistribution structure is in physical contact with a top surface of the second connector and partially overlaps with the second connector in the plan view, the second via being laterally offset from the second connector by a first non-zero distance in a first direction, wherein a third via of the redistribution structure is in physical contact with a top surface of the third connector and partially overlaps with the third connector in the plan view, the third via being laterally offset from the third connector by a second non-zero distance in a second direction different from the first direction, and wherein a fourth via of the redistribution structure is in physical contact with a top surface of the fourth connector and partially overlaps with the fourth connector in the plan view, the fourth via being laterally offset from the fourth connector by a third non-zero distance in a third direction different from the first direction and the second direction.
1 more element
Dependencies are inferred from the claim text.