Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device

A semiconductor device, comprising:

• a package structure disposed on a circuit substrate, wherein the package structure comprises:
• a semiconductor die and an insulating encapsulant surrounding the semiconductor die;
• a first heat dissipation element located over a first surface of the insulating encapsulant, wherein the first heat dissipation element comprises a conductive base and a plurality of antenna patterns, and a ratio of a thickness of the first heat dissipation element to a thickness of the insulating encapsulant is in a range of 1:1 to 1:5, and wherein sidewalls of the first heat dissipation element are aligned with sidewalls of the insulating encapsulant;
• and
• a plurality of conductive balls located over a second surface of the insulating encapsulant in between the insulating encapsulant and the circuit substrate.

A method of fabricating a package structure, comprising:

• forming a first redistribution layer on a conductive carrier, wherein forming the first redistribution layer comprises forming at least one feed line and one ground plate, and the feed line is electrically connected to the conductive carrier;
• providing a semiconductor die on the first redistribution layer and forming an insulating encapsulant surrounding the semiconductor die;
• patterning the conductive carrier to form a heat dissipation element comprising a conductive base and a plurality of antenna patterns, wherein the plurality of antenna patterns is electrically connected to the feed line and is electrically coupled to the ground plate of the first redistribution layer, and
• performing a dicing process by cutting through the first redistribution layer, the heat dissipation element, and the insulating encapsulant so that sidewalls of the heat dissipation element are aligned with sidewalls of the insulating encapsulant.