Device and package structure and method of forming the same

A device structure, comprising:

• a die, encapsulated by an encapsulant;
• a conductive via structure located aside the die and in the encapsulant;
• a dielectric layer overlying the die and the encapsulant;
• and
• a conductive connector, disposed on and connected with the conductive via structure, wherein the dielectric layer surrounds the conductive connector, the conductive connector extends beyond the conductive via structure, and the conductive connector physically contacts the encapsulant and the conductive via structure.

A package structure, comprising:

• a die laterally encapsulated by an encapsulant;
• a conductive via structure disposed aside the die and penetrating through the encapsulant;
• a seed layer overlying the conductive via structure;
• and
• a conductive connector connected with the seed layer and the conductive via structure, wherein the conductive via structure protrudes from the encapsulant, and the conductive connector extends into the encapsulant and physically contacts the seed layer and an upper sidewall of the conductive via structure.