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US 11,444,017 B2Granted
Semiconductor package and method of manufacturing a semiconductor package
AssigneeInfineon Technologies Austria AG
InventorsSergey Yuferev, Robert Fehler, Petteri Palm
Life of this patent
Estimating the term…
Abstract
In an embodiment, a semiconductor package includes a semiconductor device embedded in an insulating layer, a contact pad having an area, and a vertical redistribution structure including substantially parallel vertical paths arranged in the insulating layer and extending perpendicular to the area of the contact pad. The substantially vertical paths are non-uniformly distributed over the area of the contact pad.
Claims10
A semiconductor package, comprising:
- a semiconductor device embedded in an insulating layer;
- a contact pad having an area that does not overlap the semiconductor device, and
- a vertical current redistribution structure comprising substantially parallel vertical current paths arranged in the insulating layer and extending perpendicular to the area of the contact pad that does not overlap the semiconductor device, the substantially parallel vertical current paths being non-uniformly distributed over the area of the contact pad that does not overlap the semiconductor device.
Dependencies are inferred from the claim text.