Electronic device with stud bumps
AssigneeTDK Corporation
InventorWolfgang Pahl
Life of this patent
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Abstract
An electronic device with stud bumps is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, wherein the carrier board has at least one recess in the upper surface, and wherein at least one of the stud bumps reaches into the recess.
Claims16
An electronic device comprising:
- a carrier board having an upper surface;
- and
- an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side,
- wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side,
- wherein the carrier board has at least one recess in the upper surface, and
- wherein at least one of the stud bumps reaches into the recess.
An electronic device comprising:
- a carrier board having an upper surface;
- and
- an electronic chip mounted on the upper surface, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface, and sidewalls connecting the mounting side to the top side,
- wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side,
- wherein the stud bumps are connected to the upper surface of the carrier board by a conductive adhesive, and
- wherein the conductive adhesive has a Young's modulus of equal to or less than 500 MPa.
Dependencies are inferred from the claim text.