Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame

An electronic component apparatus comprising:

• a first lead frame that has an inner side connection terminal and an outer side connection terminal;
• a second lead frame that is provided on the first lead frame;
• a first electronic component that is provided between the first lead frame and the second lead frame;
• a connection member that is provided between the first lead frame and the second lead frame;
• and
• an insulating resin that is filled between the first lead frame and the second lead frame so as to cover the first electronic component and the connection member;
• wherein:
• a first oxide film is provided on a surface of the first lead frame;
• a second oxide film is provided on a surface of the second lead frame;
• the first lead frame and the second lead frame are electrically connected to each other by the connection member;
• a first connection portion exposed from the first oxide film is provided on an upper surface of the outer side connection terminal of the first lead frame;
• a second connection portion exposed from the second oxide film is provided on the surface of the second lead frame;
• the first connection portion and the second connection portion are bonded to the connection member;
• a third connection portion is provided on an upper surface of the inner side connection terminal of the first lead frame and is connected to the first electronic component;
• an external electrode is provided on a lower surface of the outer side connection terminal of the first lead frame;
• a thickness in a width direction of the electronic component apparatus of the inner side connection terminal of the first lead frame is less than that of the outer side connection terminal of the first lead frame;
• a first outer side face and a second outer side face of the outer side connection terminal of the first lead frame are exposed from an outer side face of the insulating resin;
• the first outer side face of the outer side connection terminal of the first lead frame is flush with the outer side face of the insulating resin;
• and
• the second outer side face of the outer side connection terminal of the first lead frame retracts from the outer side face of the insulating resin toward an inner side of the electronic component apparatus.