Package structure

A package structure, comprising:

• a semiconductor package;
• a top plate and a bottom plate, disposed on opposite sides of the semiconductor package;
• a buffer element, disposed between the semiconductor package and the top plate, wherein the buffer element comprises a first opening and a second opening, wherein the first and second openings extend through the buffer element;
• a thermal interface material (TIM), disposed in the first opening of the buffer element and in contact with the semiconductor package and the top plate;
• a screw, penetrating through the second opening of the buffer element and securing the bottom plate, the semiconductor package, the buffer element and the top plate;
• and
• a pair of washers, sleeving a main portion of the screw, wherein the pair of washers are between the first plate and a head portion of the screw.

A package structure, comprising:

• a first plate;
• a plurality of dies, disposed over the first plate and laterally encapsulated by an insulating encapsulant;
• a redistribution structure, disposed over the plurality of dies and the insulating encapsulant;
• a device, disposed over and bonded to the redistribution structure, wherein the plurality of dies, the insulating encapsulant, the redistribution structure and the device form a wafer form structure;
• a second plate, disposed over the device;
• a buffer layer, disposed between the wafer form structure and the second plate;
• a first thermal interface material (TIM) disposed between the device and the second plate, wherein the first TIM is surrounded by and in contact with the buffer layer;
• and
• a screw, penetrating through the first plate, the insulating encapsulant, the redistribution and the second plate, wherein the screw comprises a main portion and a head portion connected to the main portion;
• and
• a pair of washers, sleeving the main portion of the screw and disposed between the first plate and the head portion of the screw, wherein each washer among the pair of washers comprises a first ring-shaped surface and a second ring-shaped surface opposite to the first ring-shaped surface, each washer among the pair of washers comprises cams arranged on the first ring-shaped surface, each washer among the pair of washers comprises seizing ridges distributed on the second ring-shaped surface, and the pair of washers join together through the cams.