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US 11,444,000 B2Granted
Charger
AssigneeAlpha and Omega Semiconductor (Cayman) Ltd.
InventorsYu-Ming Chen, Tien-Chi Lin, Guan-Yu Lin, Tin-Wei Chen
Life of this patent
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Abstract
A charger includes a thermal conductive plate for heat dissipation, and a transistor. The transistor includes a drain terminal of a first pulsating voltage level, and a source terminal of a second pulsating voltage level. The second pulsating voltage level is lower than the first pulsating voltage level. The source terminal is disposed closer to the thermal conductive plate than the drain terminal.
Claims18
A charger, comprising:
- a thermal conductive plate for heat dissipation;
- and
- a transistor, comprising:
- a drain terminal of a first pulsating voltage level;
- and
- a source terminal of a second pulsating voltage level lower than the first pulsating voltage level;
- wherein the source terminal is connected to the thermal conductive plate;
- wherein the thermal conductive plate is disposed on a first surface of a mother board;
- wherein the mother board comprises one or more thermal conductive layers embedded in the mother board between the first surface and a second surface opposite the first surface;
- wherein the one or more thermal conductive layers are connected to the thermal conductive plate;
- and
- wherein the thermal conductive plate is between the transistor and the mother board.
9 more elements
A charger, comprising:
- a thermal conductive plate for heat dissipation;
- and
- a transistor, comprising:
- a drain terminal of a first pulsating voltage level;
- and
- a source terminal of a second pulsating voltage level lower than the first pulsating voltage level;
- wherein the source terminal is connected to the thermal conductive plate;
- wherein the thermal conductive plate is disposed on a first surface of a mother board;
- wherein the mother board comprises one or more thermal conductive layers embedded in the mother board between the first surface and a second surface opposite the first surface;
- wherein the one or more thermal conductive layers are connected to the thermal conductive plate;
- and
- wherein the source terminal is attached to a carrier and wherein the drain terminal is wire-bonded and is connected to a first plurality of pins of the carrier.
9 more elements
A charger, comprising:
- a thermal conductive plate for heat dissipation;
- and
- a semiconductor device, comprising:
- a carrier comprising a die pad, a first plurality of pins and a second plurality of pins;
- and
- a transistor attached to the carrier, the transistor comprising:
- a drain terminal of a first pulsating voltage level, the drain terminal being wire-bonded and being connected to the first plurality of pins of the carrier;
- and
- a source terminal of a second pulsating voltage level lower than the first pulsating voltage level, the source terminal being attached to the die pad of the carrier,
- wherein the second plurality of pins are connected to the die pad;
- wherein the second plurality of pins are exposed from the semiconductor device;
- and
- wherein the second plurality of pins are attached to the thermal conductive plate.
10 more elements
Dependencies are inferred from the claim text.