Integrated circuit package and method

A method comprising:

• directly bonding a first insulating layer of a first die to a second insulating layer of a second die;
• depositing a passivation layer over and along sidewalls of the second die and over a top surface of the first die;
• forming a plurality of thermal vias over the passivation layer and adjacent the second die, wherein the passivation layer separates the plurality of thermal vias from the first die;
• encapsulating the first die, the second die, and the plurality of thermal vias in an encapsulant;
• and
• forming a redistribution structure over the encapsulant, the first die, and the second die.

A method comprising:

• directly bonding a first die to a second die;
• depositing a seed layer over a backside of the first die;
• plating a plurality of thermal vias on the seed layer, the plurality of thermal vias being adjacent to the second die;
• encapsulating the first die, the second die, and the plurality of thermal vias in an encapsulant;
• and
• forming a redistribution structure on an opposing side of the first die as the second die.