Electronic package, electronic packaging module having the electronic package, and method for fabricating the electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsJin-Wei You, Cheng-Kai Chang
Life of this patent
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Abstract
The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other. Since the laser component and the optoelectronic component are separated from each other, the electronic package has a reduced fabrication difficulty and a high yield rate. A method for fabricating the electronic package and an electronic packaging module having the electronic package are also provided.
Claims20
An electronic package, comprising:
- an encapsulation layer having a first surface, a second surface opposing the first surface, and a lateral surface adjoining the first surface and the second surface;
- a first electronic component embedded in the encapsulation layer;
- a plurality of conductive pillars embedded in the encapsulation layer;
- a circuit structure formed on the first surface of the encapsulation layer and electrically connected to the conductive pillars and the first electronic component;
- a laser component disposed on the circuit structure and electrically connected to the circuit structure;
- and
- an optoelectronic component disposed on the circuit structure and electrically connected to the circuit structure,
- wherein the laser component and the optoelectronic component are separated from each other, and wherein at least one of the laser component and the optoelectronic component protrudes from the lateral surface of the encapsulation layer.
A method for fabricating an electronic package, comprising:
- disposing a plurality of conductive pillars and at least one first electronic component on a carrying board;
- forming on the carrying board an encapsulation layer encapsulating the first electronic component and the conductive pillars, the encapsulation layer having a first surface, a second surface opposing the first surface and bonded to the carrying board, with end surfaces of the conductive pillars exposed from the first surface of the encapsulation layer;
- disposing a circuit structure on the first surface of the encapsulation layer and electrically connecting the circuit structure to the conductive pillars and the first electronic component, wherein the encapsulation layer has a lateral surface adjoining the first surface and the second surface;
- disposing a laser component and an optoelectronic component on the circuit structure and electrically connecting the laser component and the optoelectronic component to the circuit structure, wherein the laser component and the optoelectronic component are separated from each other, and wherein at least one of the laser component and the optoelectronic component protrudes from the lateral surface of the encapsulation layer;
- and
- removing the carrying board.
Dependencies are inferred from the claim text.