Array substrate, display panel, method of fabricating display panel, and mother substrate

A method of fabricating an array substrate having a display area, a peripheral area, and a bonding area inside the peripheral area, comprising:

• forming a bonding pad in the bonding area, the bonding pad configured to be connected to a peripheral circuit through a bonding connector;
• forming a test signal line comprising a first portion and a second portion;
• wherein the first portion is formed in the peripheral area and substantially surrounds the display area;
• the first portion is electrically connected to the bonding pad;
• the first portion is completely inside the array substrate and has no exposed terminal;
• the second portion is formed in the bonding area;
• a first terminal of the second portion is electrically connected to the bonding pad;
• and
• a second terminal of the second portion has an end along an edge of the array substrate in the bonding area.

A mother substrate having a plurality of substrate regions and a cutting region spacing apart the plurality of substrate regions, comprising:

• an array substrate in a respective one of the plurality of substrate regions;
• and
• a testing pad in the cutting regions;
• wherein the array substrate has a display area, a peripheral area, and a bonding area inside the peripheral area;
• wherein the array substrate comprises:
• a bonding pad in the bonding area, the bonding pad configured to be connected to a peripheral circuit through a bonding connector;
• a test signal line comprising a first portion and a third portion;
• wherein the first portion is in the peripheral area and substantially surrounds the display area;
• the first portion is electrically connected to the bonding pad;
• the first portion is completely inside the array substrate and has no exposed terminal;
• the third portion extends from the bonding area into the cutting region to connect to the testing pad;
• a first terminal of the third portion is electrically connected to the bonding pad;
• and
• a second terminal of the third portion is electrically connected to the testing pad.