Semiconductor device and method for manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorKyung Yub Jeon
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AssigneeSamsung Electronics Co., Ltd.
InventorKyung Yub Jeon
Estimating the term…
A method for manufacturing a semiconductor is provided. A first oxide layer is formed on a substrate. A first nitride layer is formed on the first oxide layer. A second oxide layer, a second nitride layer are formed on the first nitride layer. A polysilicon layer is formed on the second nitride layer. A third nitride layer is formed on the polysilicon layer. One or more first patterns are formed on the third nitride layer. The one or more first patterns are transferred to the polysilicon layer to form one or more patterned polysilicon layer. A portion of the first oxide layer, first nitride layer, second oxide layer, and second nitride layer are removed using the one or more patterned polysilicon layer as a first mask.
A semiconductor device including:
A method for manufacturing a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.