Bonding method of package components and bonding apparatus

A bonding apparatus, comprising:

• an electromagnetic wave generator;
• a housing, connected to the electromagnetic wave generator and configured to accommodate at least one first package component and a second package component on which the at least one first package component is placed, wherein first electrical connectors at a bonding surface of the at least one first package component approximate or contact second electrical connectors at a bonding surface of the second package component, the electromagnetic wave generator is configured to provide an electromagnetic wave into the housing for inducing heating of the first electrical connectors and the second electrical connectors, in order to bond the first electrical connectors with the second electrical connectors;
• and
• an electromagnetic wave absorption tank, wherein the electromagnetic wave absorption tank is connected to the housing via an additional wave guide and configured to absorb the electromagnetic wave,
• wherein conductive elements in the at least one first package component and the second package component larger than a critical dimension are targeted by the inductive heating, and the first and second connectors are included in the conductive elements larger than the critical dimension, and
• wherein conductive elements smaller than the critical dimension as well as insulating elements in the at least one first package component and the second package component are not targeted by the inductive heating.

A bonding method of package components, comprising:

• placing a first package component on a second package component, wherein a first dielectric layer at a bonding surface of the first package component is in contact with a second dielectric layer at a bonding surface of the second package component, and first electrical connectors at the bonding surface of the first package component are aligned with second electrical connectors at the bonding surface of the second package component;
• non-selectively heating the first and second package components, such that the first dielectric layer is bonded with the second dielectric layer;
• and
• selectively heating conductive elements in the first and second package components larger than a critical dimension by an electromagnetic wave provided by an electromagnetic wave generator, wherein the first and second electrical connectors are included in the conductive elements larger than the critical dimension, the first electrical connectors are bonded with the second electrical connectors as a result of the selective heating, conductive elements smaller than the critical dimension as well as insulating elements in the first and second package components are not targeted by the selective heating, the first and second package components are placed in a housing connected to the electromagnetic wave generator during the selectively heating, and an electromagnetic wave absorption tank is connected to the housing for absorbing excessive portions of the electromagnetic wave.