Methods of forming a package substrate

A method of forming a system, comprising:

• providing a temporary substrate;
• forming a first plurality of contact pads on a top surface of the temporary substrate, wherein the first plurality of contact pads has both wide and narrow contact pads;
• forming at least one insulating layer and at least one conductive layer on the first plurality of contact pads, wherein a top conductive layer forms a second plurality of contact pads on a top surface of a topmost insulating layer, wherein the second plurality of contact pads has both wide and narrow contact pads, and wherein the wide contact pads of the second plurality of contact pads are vertically over the wide contact pads of the first plurality of contact pads, and the narrow contact pads of the second plurality of contact pads are vertically over the narrow contact pads of the first plurality of contact pads;
• forming a first layer of solder resist on the top surface of the topmost insulating layer, exposing at least a portion of the second plurality of contact pads;
• removing the temporary substrate to expose a bottom surface of a bottommost insulating layer;
• temporarily flattening an intermediate structure;
• forming a second layer of solder resist on the bottom surface of the bottommost insulating layer, exposing at least a portion of the first plurality of contact pads;
• and
• subsequent to forming both the first layer of solder resist and the second layer of solder resist, coupling one of the first plurality of contact pads or the second plurality of contact pads to a component having differing contact pitch, and coupling the other of the first plurality of contact pads or the second plurality of contact pads to a fine-pitch component and to a board.