Substrate processing apparatus and substrate processing system

A substrate processing apparatus, comprising:

• a placing table configured to hold a substrate having a processing target film, which is decomposed by irradiating an ultraviolet ray thereto under an oxygen-containing atmosphere;
• a processing chamber, configured to accommodate therein the substrate placed on the placing table, having therein the oxygen-containing atmosphere;
• an ultraviolet ray irradiation device configured to irradiate the ultraviolet ray to the substrate within the processing chamber;
• a gas exhaust device configured to exhaust an inside of the processing chamber;
• and
• a controller configured to output a control signal such that a removing process of removing a part of the processing target film by irradiating the ultraviolet ray to the substrate from the ultraviolet ray irradiation device is performed in a state where the exhaust of the inside of the processing chamber by the gas exhaust device is stopped such that a gas flow velocity within the processing chamber is equal to or smaller than 10 cm/sec, and then an exhausting process of exhausting the inside of the processing chamber by the gas exhaust device is performed.